In semiconductor industry, miniaturization has always led to more fast and dense packed integrated circuits showing increased performance and efficiency. Although the limits of physical feasibility are within a certain reach, development undoubtedly continues to this day. Especially in the backend of semiconductor manufacturing the interconnecting, packaging and testing is continuing its miniaturization with steadily increasing demands on quality.
Besides semiconductor components manufacturing Nanotechnology opens up completely new applications for classical materials being processed through semiconductor processes. The innovative development of measurement technology at Solarius keeps pace with this miniaturization and provides right metrology at the right time, ensuring robust results in the characterization of micro- and nanosystems.
In particular, direct bonding and 3D stacking of semiconductor elements drive etched and deposited structure size to always smaller dimensions. Along with this, reuqirements to optical metrology increase. Being restricted to physical boundaries, innovative ideas in how to best reach these limits in sensor and system hardware design and manufacturing pose the current challenge for optical metrology industry. Solarius is innovating to make available optical technology for a wide band of critical dimension metrology to support stable and fast high volume manufacturing on wafer and panel level.