Planar Magnetron Sputter Deposition Source (Planar Magnetron)
Products
Description:
1. Versatile and optimized simulation to enhance magnetic field design, custom to meet different coating process requirements.
2. Paticular magnetic field that is suitable for sputtering 6mm Ni target.
3 Patent anode water cooling design, effectively eliminate substrate thermal effect.
4. Gas distribution adjustable in a quick and flexible way, adjust deposition uniformity efficiently.
Target Material size:
- Target Width: 50mm,75,100,125,150, 200mm
- Length: up to 6000mm
- Electrode: M8 or Φ20 stud, N, HN,7/16 RF, bespoke
- Mounting Type: Internal-mount, External-mount
- Cooling Design: Direct cooling,Indirect cooling
- Magnet strength: standard, strong
- Magnet field type: Balanced, Unbalanced, High Yield
- Power Supply Unit: DC/Pulsed-DC/MF/RF/HiPIMS
Specifications:
- Model:DST-PMEH100500-AS-AU
- Exterior Dimension: 640mmx290mm
- Target size: 100x500x6mm
- Electrode: M8 studs
- Gas Compression Fittings: single section distribution, 1/4 inch male coupler connector x2pcs
- Gas distribution adjustable; magnetic strength adjustable; balance/ unbalance magnetic field adjustable;
Water Cooling Fittings:
- Cathode(main):16x12 PU tube, quick release coupling(screw), 2x in, 2x out;
- Anode:12x 8 PU tube, quick release coupling(screw), 2x in, 2x out;
- Back plate:12x 8 PU tube, quick release coupling(screw), 1x in, 1x out;
Installation Requirements:
- Cold water Temp.: 18-22°C
- Water Pressure: < 3KG/cm2
- Water flow rate: >1.5L/min/KW